LAM 810-800081-022 PCB ASSY P2MB.V ME.ETCH.These processes involve the use of complex combinations of materials that need to be removed to fabricate increasingly smaller and complex features. The main technique, reactive ion etching (RIE), activates the wafer surface with ions (charged particles) to remove material. Advanced etching techniques, such as atomic layer etching (ALE), are able to remove several atomic layers of material at a time.
810-800081-022 is a part number that refers to a printed circuit board (PCB) used in a backplane for a VME system. According to xiongbagk.cn, the PCB material is made of FR4-TG170, which has a higher glass transition temperature and better flame resistance than FR4-TG130. The material is also selected from a specific supplier with a dielectric constant not greater than 4.4 to reduce crosstalk. The dimensions of the PCB are provided by sauldcs.com: 5.1cm x 40.6cm x 25.4cm. The weight of the PCB is 2.7 kg, and it comes with a one-year warranty
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